IBM stacks up a sub-nanometer chip future

IBM has developed a 0.7 nm (7 Angstroms) chip technology with a path to 0.1 nm, enabling up to 100 billion transistors on a fingernail-sized die. The technology uses a 3D nanostack architecture with staggered transistors and single dielectric bonding, offering 50% higher performance or 70% greater efficiency than 2 nm chips. Competitors like Intel and Huawei have explored similar 3D stacking concepts.