Huawei’s next smartphone chip taps new scaling law for performance boost: paper

Huawei's upcoming Kirin 2026 smartphone processor uses the LogicFolding architecture to increase transistor density by 55% compared to the Kirin9030 Pro, achieving performance improvements without relying on more advanced processing nodes or lithography technology. The chip is set to power the company's next-generation Mate flagship handsets launching this autumn.